Research in the ARTS laboratory focuses on cyber-physical systems. Cyber-physical systems are an increasingly important part of modern society, encompassing applications under computer control. They range in complexity from simple appliances to chemical plants, power distribution grids, automobiles, and aircraft. This website contains links to past and present projects.
Research topics include computing circuits, architectures, and applications such as: CAD for synthesis and verification; VLSI for signal processing, reconfigurable computing (FPGAs), cryptography, hardware security, and low-power design techniques.
This group is led by Prof. Csaba Andras Moritz. Our research addresses the fundamental problem of how to realize computation with nanotechnology. Our focus is on post-CMOS nanoscale fabrics and associated models of computation, based on emerging nanodevices (nanowire, spintronics, and graphene) and novel nanomanufacturing paradigms. We follow a 'fabric-centric' mindset - an integrated approach across various design levels (architecture, circuits, devices and manufacturing at nanoscale), leveraging the unique properties of new nanomaterials/nanodevices/physical phenomena. We do experimental (Cleanroom) work in addition to detailed cross-layer theoretical exploration.
The Reconfigurable Computing Group is under the direction of Professor Russell Tessier and focuses on a variety of topics in reconfigurable computing including CAD for FPGAs, adaptive systems on a chip, and adaptive implementations of communication coding in reconfigurable hardware.
This group is led by Prof. Maciej Ciesielski. Electronic Design Automation for digital systems. Formal methods in Computer-Aided Design. Behavioral and RTL synthesis. Formal verification and design validation.
- Interconnects play an increasing role in all electronic and information systems, allowing fast and high bandwidth communication both on-chip and off-chip.
- Synchronization of systems with robust and adaptive clocking systems are a very important aspect of the most advanced multi-core microprocessors.
- 3D technologies are emerging and present great opportunities but also new challenges in interconnect, thermal issues, mixed-technologies and power delivery.
- Power consumption continues to be a challenge in battery-powered, wall-powered and now even wirelessly-powered systems. Increased power density and especially device leakage, leads to increasing temperature which must be sensed and mitigated both at design-time and run-time.
- Side-channel Leakage and On-Chip Monitors: Power consumption, timing information, temperature, faults and electromagnetic radiation all can be monitored to optimize the system as well as to attack and divulge secret information in the system.
- Finally, computation and communication in the presence of uncertain manufacturing process, voltage noise and temperature has become a primary design issue.