The University of Massachusetts Amherst
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Jackson Takes over as Acting ECE Department Head

Robert Jackson

Robert Jackson

While Professor Christopher Hollot, the longtime department head of the Electrical and Computer Engineering (ECE) Department, serves as the interim dean in the College of Engineering, Professor Robert W. Jackson is taking over as the interim ECE department head. Among many other honors, Jackson was elected as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2004 “for contributions to the electromagnetic modeling of microwave integrated circuits and packaging.”

Jackson joined the College of Engineering faculty in 1982, and during his academic career has published more than 75 journal and conference papers and served as a PI or co-PI on more than 35 funded research projects.

Jackson’s research deals with the modeling of active and passive microwave circuits, active antennas, and microwave and millimeter wave integrated circuit design. He is a co-director of  the Laboratory for Millimeter Wave Devices and Applications.

 Before he came to the UMass Amherst in September of 1982, Jackson had worked as an assistant professor at Northeastern University, where he also earned his B.S., M.S., and Ph.D. degrees.

Jackson has served as an associate editor of Transactions on Microwave Theory and Techniques. He was also the guest editor for special issues of: IEEE Transactions on Components, Packaging, and Manufacturing Technology; Transactions on Microwave Theory and Techniques; and the International Journal of RF and Microwave Computer-Aided Engineering. In addition, he served on the editorial board of the International Journal of RF and Microwave Computer-Aided Engineering.

In addition, Professor Jackson has volunteered his time on committees for many professional organizations and conferences, including the IEEE Society on Microwave Theory and Techniques, the International Microwave Symposium, the Topical Meeting on the Electrical Performance of Electronic Packaging, and the IEEE Society on Components, Packaging, and Manufacturing Technology. (January 2019)